HIGH IMPACT SOLDER TOUGHNESS ALLOY
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United States of America Patent
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app pub date -
Dec 28, 2015
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Aug 2, 2011
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Abandoned
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Abstract
A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.
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