OPTOELECTRONIC MODULES AND ASSEMBLIES COMPRISING OPTOELECTRONIC MODULES
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United States of America Patent
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Issued Date -
May 19, 2016
app pub date -
Nov 14, 2014
filing date -
Nov 14, 2014
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Abstract
Optoelectronic modules and assemblies comprising optoelectronic modules are provided. An optoelectronic module includes an optoelectronic module printed circuit board, an optoelectronic component mounted to the optoelectronic module printed circuit board, an electrical connector affixed to the optoelectronic module printed circuit board, and a mounting bracket affixed to the optoelectronic module printed circuit board. The electrical connector is in electrical communication with an input of the optoelectronic component. The electrical connector is configured to removably plug into a mating electrical connector of a main printed circuit board. The mounting bracket includes an optoelectronic component engagement surface for engaging the optoelectronic component. The mounting bracket further includes a main printed circuit board engagement surface for engaging the main printed circuit board.
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