ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
May 19, 2016
app pub date -
Nov 11, 2015
filing date -
Nov 11, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component device includes a first insulating layer, a wiring layer, a second insulating layer, a wiring component, and first and second electronic components. The first insulating layer includes a mounting region on an upper surface thereof. The wiring layer is formed on the first insulating layer except the mounting region. The second insulating layer is formed on the first insulating layer, is formed with an opening in the mounting region, and is formed with first and second connection holes on the wiring layer. The wiring component is mounted in the mounting region and in the opening and includes first and second connecting portions. The first electronic component is connected to the first connecting portion and is connected to the wiring layer in the first connection hole. The second electronic component is connected to the second connecting portion and is connected to the wiring layer in second connection hole.
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