SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
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United States of America Patent
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Issued Date -
May 19, 2016
app pub date -
Jun 5, 2014
filing date -
Jun 18, 2013
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Abstract
A semiconductor device which is provided with: a wiring substrate which has a first region, and a relay pad and a connection pad that are arranged outside the first region; a first semiconductor chip which has an electrode pad that is formed on one surface, and which is mounted on the first region of the wiring substrate; a first wire that connects the electrode pad and the relay pad with each other; and a second wire that connects the relay pad and the connection pad with each other.
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