FIRST-PACKAGED AND LATER-ETCHED NORMAL CHIP THREE DIMENSION SYSTEM-IN-PACKAGE METAL CIRCUIT BOARD STRUCTURE AND PROCESSING METHOD THEREOF
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United States of America Patent
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May 19, 2016
app pub date -
Jan 7, 2014
filing date -
Aug 6, 2013
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Abstract
The present invention relates to a first-packaged and later-etched normal chip three dimension-on-chip metal circuit board structure and a processing method for manufacturing the same, the structure includes: metal substrate frame (1); a lead (3) provided in the metal substrate frame (1); a conductive pillar (4) provided in a top surface of the lead (3); a chip is mounted normally on a top surface of the metal circuit frame (1) or between the leads (3); a metal wire (6) via which a top surface of the chip (5) is connected to a top surface of the lead (3); a molding material (8) with which a periphery region of the lead (3), the conductive pillar (4), the chip (5) and the metal wire (6) is encapsulated, with the molding material (8) being flushed with a top of the conductive pillar (4).
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