INTEGRATED CIRCUIT PACKAGE
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United States of America Patent
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Issued Date -
May 19, 2016
app pub date -
Nov 19, 2014
filing date -
Nov 19, 2014
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Abstract
An integrated circuit package comprising a semiconductor die, a lead frame lying in a first plane, at least one conductive pillar structure extending outwardly from the first plane, wherein the lead frame and the at least one conductive pillar structure are formed of sintered conductive material, encapsulation material which encapsulates the semiconductor die, the lead frame and the at least one conductive pillar structure, a conductive layer on an upper face of the package, the conductive layer conductively connecting to the at least one conductive pillar. Methods of manufacturing are also disclosed.
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