LATENT HEAT STORAGE DEVICES
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United States of America Patent
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Issued Date -
May 19, 2016
app pub date -
Nov 17, 2014
filing date -
Nov 17, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An apparatus including a composite structure including an expanded graphite matrix infiltrated with a phase change material having dimensions configured for association with an electronic device, the composite structure including a thermal conductivity greater than 5 Watts per meter Kelvin (W/mK). An apparatus including an integrated circuit package; a planar pad including an expanded graphite matrix; and a heat sink, wherein the pad is disposed between the integrated circuit package and the heat sink. A method including placing a structure including an expanded graphite matrix on an integrated circuit package; and coupling a passive heat exchanger to the structure.
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