CAVITY PACKAGE DESIGN
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United States of America Patent
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Issued Date -
May 19, 2016
app pub date -
Jan 18, 2016
filing date -
Mar 29, 2012
priority date (Note) -
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Abstract
A semiconductor device. The device including a substrate having electrical traces, at least one of a MEMS die and a semiconductor chip mounted on the substrate, and a spacer. The spacer has a first end connected to the substrate and includes electrical interconnects coupled to the electrical traces. The at least one MEMS die and a semiconductor chip are contained within the spacer. The spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip. The cavity forms an acoustic volume when the semiconductor device is mounted to a circuit board via a second end of the spacer.
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