EMI SHIELDING STRUCTURE FOR ELECTRONIC COMPONENTS
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United States of America Patent
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Issued Date -
May 12, 2016
app pub date -
Nov 12, 2014
filing date -
Nov 12, 2014
priority date (Note) -
Abandoned
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Abstract
An EMI shielding structure for electronic components includes a cover body for enclosing and shielding at least one electronic component. The cover body includes a top section defining a chamber. A working fluid is contained in the chamber. At least one capillary structure is disposed in the chamber. One side of the top section faces the electronic component and is in contact with a top face of the electronic component. The EMI shielding structure can prevent the electronic component from electromagnetic wave interference. Also, the EMI shielding structure can enhance the heat dissipation efficiency for the electronic component.
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