MULTI-LAYER CIRCUIT BOARD
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United States of America Patent
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app pub date -
Dec 31, 2015
filing date -
Jun 27, 2012
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Abstract
A multi-layer circuit board includes a plurality of circuit substrates, a plurality of dielectric layers, and a plurality of metal bumps. Each circuit substrate includes two first trace layers and an insulating layer between the two trace layers. Each electric layer is laminated between two neighboring circuit substrates. At latest one metal bump is arranged between each two neighboring circuit substrates. Each metal bump passes through one dielectric layer. Two opposite ends of each metal bump are connected with the trace layer of the circuit substrate to be electrically connected to the two neighbor circuit substrates.
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