INTEGRATED DIODE ASSEMBLIES FOR PHOTOVOLTAIC MODULES
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Jun 15, 2015
filing date -
Nov 4, 2008
priority date (Note) -
Published
status (Latency Note)
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Abstract
Provided are bypass diode assemblies for use in photovoltaic modules. Also provided are methods of fabricating such assemblies and a method of fabricating photovoltaic modules using such assemblies. A diode assembly may include an insulating strip, at least one lead-diode assembly having a diode and two leads, and at least two interconnecting conductors overlapping with and electrically contacting the leads of the lead-diode assembly. The insulating strip supports the lead-diode assembly and conductors and at least partially insulates these components from photovoltaic cells. Specifically, during module fabrication, the interconnecting conductors make electrical connections to the back sides of the cells through cutouts in the insulating strip. The electrical connections may be made to every cell in a row or a subset of selected cells in that row. In certain embodiments, the same interconnecting conductor is connected to two or more cells positioned in adjacent rows.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
BEIJING APOLLO DING RONG SOLAR TECHNOLOGY CO LTD | NO 7 RONG CHANG DONG STREET NO 6 BUILDING ROOM 3001 BEIJING ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA BEIJING 100176 |
International Classification(s)

- 2015 Application Filing Year
- H01L Class
- 25498 Applications Filed
- 22451 Patents Issued To-Date
- 88.06 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Croft, Steven Thomas | Menlo Park, US | 21 | 370 |
# of filed Patents : 21 Total Citations : 370 | |||
Ghandour, Osman | Morgan Hill, US | 6 | 52 |
# of filed Patents : 6 Total Citations : 52 | |||
Halstead, Whitfield Gardner | Palo Alto, US | 3 | 21 |
# of filed Patents : 3 Total Citations : 21 |
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Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 9 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 12, 2027 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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