SPUTTERING SYSTEM AND METHOD FOR HIGHLY MAGNETIC MATERIALS
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United States of America Patent
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Issued Date -
Aug 20, 2015
app pub date -
May 29, 2014
filing date -
Nov 4, 2011
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Abstract
A system for depositing material from a target onto substrates, comprising a processing chamber; a sputtering target having length L and having highly magnetic sputtering material provided on front surface thereof a magnet assembly operable to reciprocally scan across the length L in close proximity to rear surface of the target and the magnet assembly comprises: a back plate made of magnetic material; a first group of magnets arranged in a single line central to the back plate and having a first pole positioned to face the rear surface of the target; and, a second group of magnets provided around periphery of the back plate so as to surround the first group of magnets, the second group of magnets having a second pole, opposite the first pole, positioned to face the rear surface of the target.
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