ASSEMBLING DEVICES FOR PROBE CARD TESTING
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United States of America Patent
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Nov 10, 2014
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Nov 10, 2014
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Abstract
An example process places dice that have been cut from a first semiconductor wafer on a second wafer. The example process includes arranging the dice in a pattern on a the second wafer, where the second wafer has a coefficient of thermal expansion that has substantially a same coefficient of thermal expansion as the dice; and using a probe card that is matched to a pattern of dice in connection with the second wafer.
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