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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ENSIGN-BICKFORD AEROSPACE & DEFENSE COMPANY	640 HOPMEADOW STREET SIMSBURY CT 06070

International Classification(s)

• E21B:EARTH OR ROCK DRILLING

• 2015 Application Filing Year
• E21B Class
• 4392 Applications Filed
• 3453 Patents Issued To-Date
• 78.63 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Garvey, Alan J	Suffield, US	3	45
# of filed Patents : 3 Total Citations : 45
Morris, Marc A	Clarksville, US	4	48
# of filed Patents : 4 Total Citations : 48

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Patent Citation Ranking

• 38 Citation Count
• E21B Class

• 87.64 % this patent is cited more than
• 9 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 12, 2027

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2018/0031,629

TEST BOARD FOR SEMICONDUCTOR PACKAGE, TEST SYSTEM, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

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Abstract

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A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.

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Description

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Claims

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