WIRING BOARD
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Oct 21, 2015
filing date -
Oct 30, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The wiring board of the present invention includes an insulating layer, a strip-shaped wiring conductor for signals disposed on a main surface of the insulating layer, and a plain conductor for grounding or power disposed on the main surface of the insulating layer; and the thickness of the plane conductor is larger than the thickness of the strip-shaped wiring conductor. In the wiring board of the present invention, the thickness of the plane conductor is preferably 1 to 15 μm larger than the thickness of the strip-shaped wiring conductor. The strip-shaped wiring conductor has a thickness of preferably 3 to 10 μm, and the plane conductor has a thickness of preferably 5 to 15 μm.
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