COVER-LAYER CUTTING APPARATUS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 5, 2016
app pub date -
Nov 3, 2014
filing date -
Nov 3, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Disclosed is a cover-layer cutting apparatus that provides a slit in a cover layer of an insulated electric wire. The apparatus includes a disk cutter configured to cut the cover layer, a lifting unit configured to raise and lower the disk cutter in an up-and-down direction (Y-axis direction), and a traversing unit configured to advance and retreat the disk cutter in a right-and-left direction (X-axis direction). The disk cutter is moved by the lifting unit and the traversing unit so that the disk cutter travels on an orbital path along an outer periphery of the electric wire while the disk cutter cuts the cover layer. A contact point of the disk cutter with the cover layer is shifted as a slit is being formed in the cover layer of the electric wire.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully