SIGNAL PATHS FOR RADIO-FREQUENCY MODULES
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Oct 30, 2015
filing date -
Oct 31, 2014
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Abstract
Signal paths for radio-frequency (RF) modules. In some embodiments, an RF module can include a plurality of components configured to facilitate processing of an RF signal, and a packaging substrate on which the plurality of components are mounted. The packaging substrate can have multiple layers and include an RF signal path implemented on a selected layer. Each of at least one neighboring layer above the selected layer and at least one neighboring layer below the selected layer can be configured to be sufficiently free of a ground feature relative to the RF signal path to yield a reduced parasitic capacitance while substantially maintaining a desired impedance for the RF signal path.
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