SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE
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United States of America Patent
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May 5, 2016
app pub date -
Nov 4, 2015
filing date -
Nov 4, 2014
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Abstract
A semiconductor device includes a semiconductor chip having a first main surface and a second main surface. A chip electrode is disposed on the first main surface. The chip electrode includes a first metal layer and wherein the first metal layer is arranged between the semiconductor chip and the second metal layer.
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