LEADLESS SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Oct 29, 2014
filing date -
Oct 29, 2014
priority date (Note) -
Abandoned
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Abstract
Consistent with an example embodiment, there is a leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon. At least five I/O terminals each of said terminals comprise a respective metal side pad; and the respective metal side pad has a step profile. A feature of this embodiment is that these metal side pads, having a step profile, are electroplated to enhance their solderability.
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