Family

+

−

• No Family data available.

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
NXP B V	HIGH TECH CAMPUS 60 EINDHOVEN NL-5656

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• 2014 Application Filing Year
• H01L Class
• 23828 Applications Filed
• 21803 Patents Issued To-Date
• 91.51 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Fung, Yee Wai	Kwai Chung, HK	3	12
# of filed Patents : 3 Total Citations : 12
Ho, WaiKeung	Kwai Chung, HK	2	12
# of filed Patents : 2 Total Citations : 12
Leung, Chi Ho	Kwun Tong, HK	22	85
# of filed Patents : 22 Total Citations : 85

Cited Art Landscape

Load Citation

• No Cited Art to Display

Loading Cited Art Landscape...

Patent Citation Ranking

• 3 Citation Count
• H01L Class

• 13.47 % this patent is cited more than
• 9 Age

Forward Cite Landscape

Load Citation

• No Forward Cites to Display

Loading Forward Cite Landscape...

Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 5, 2027

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2016/0126,169

LEADLESS SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

---

Abstract

---

Consistent with an example embodiment, there is a leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon. At least five I/O terminals each of said terminals comprise a respective metal side pad; and the respective metal side pad has a step profile. A feature of this embodiment is that these metal side pads, having a step profile, are electroplated to enhance their solderability.

---

 

---

Description

---

Claims

---

Claims data not available

---

Legal Events

• No Legal Status data available.