METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Oct 30, 2015
filing date -
Oct 30, 2014
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Abstract
A method of connecting a substrate is provided, wherein the substrate may include a first main surface and a second main surface opposite the first main surface. The method may include forming at least one protrusion on the first main surface of the substrate, forming a fixing agent over the first main surface of the substrate and over the at least one protrusion; and arranging the substrate on a carrier. The at least one protrusion may contact a surface of the carrier and may be configured to keep the first main surface of the substrate at a distance to the contacted surface of the carrier corresponding to a height of the protrusion, thereby forming a space between the first main surface of the substrate and the carrier. During the arranging the substrate on the carrier, at least a part of the fixing agent formed over the at least one protrusion may be displaced into the space between the first main surface of the substrate and the carrier.
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