MULTI-CHIP PACKAGED FUNCTION INCLUDING A PROGRAMMABLE DEVICE AND A FIXED FUNCTION DIE AND USE FOR APPLICATION ACCELERATION
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
May 22, 2015
filing date -
May 22, 2015
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Abstract
One or more processing functions may be off-loaded from a general-purpose processing device to auxiliary processing devices. The auxiliary processing devices may include a programmable element and a fixed-function element that may be pre-configured to perform the one or more processing functions. The programmable element and the fixed-function element may be dies of a multi-chip module (MOM) in a common package that can contain the general-purpose processing device, or the general-purpose processing device may reside outside of the MOM.
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