Fluid-filled pressure sensor assembly capable of higher pressure environments
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United States of America Patent
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Sep 6, 2022
Grant Date -
May 5, 2016
app pub date -
Nov 5, 2014
filing date -
Nov 5, 2014
priority date (Note) -
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Abstract
This disclosure provides systems and methods for a fluid-filled pressure sensor assembly for higher pressure environments. A fluid-filled pressure sensor assembly may be adapted for coupling to a structure at a mating surface and may include a header; a pressure sensor coupled to the header; a diaphragm coupled to the header and configured for positioning forward of the mating surface so that a fluid region is disposed between the diaphragm and the pressure sensor; a fill hole coupled to the fluid region; a sealing element coupled to the fill hole and configured for positioning forward of the mating surface; and wherein during operation the first pressure applied at the diaphragm is substantially transferred by the fluid in the fluid region and the fill hole to an inner-side of the sealing element and the first pressure is about equivalent to a second pressure applied at an outer-side of the sealing element.
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