CIRCUIT BOARD FOR DRIVING FLIP-CHIP LIGHT EMITTING CHIP AND LIGHT EMITTING MODULE COMPRISING THE SAME
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Oct 29, 2015
filing date -
Oct 30, 2014
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Abstract
A circuit board for driving a flip-chip light emitting chip is disclosed. The circuit board includes a metal substrate having a first surface and a second surface, the first surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area for providing a first voltage; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area for providing a second voltage; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the first surface; wherein the heat conduction area is exposed from the solder resist layer.
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