ABOVEGROUND POOL PUMP TRAP BOND RETROFIT KIT
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
Oct 30, 2014
filing date -
Oct 30, 2014
priority date (Note) -
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Abstract
A retrofit kit for use with aboveground pools, the kit having a bonding conductor with a body portion configured to reside within a component attached to the aboveground pool. The bonding conductor includes an extension portion configured to extend outwardly from an outer surface of the component. The retrofit kit includes a strain relief fitting configured to receive the extension portion of the bonding conductor, and to couple with the component attached to the aboveground pool. The retrofit kit also includes a conductor fitting configured to attach to the extension portion of the bonding conductor and to attach to a conductive system for the aboveground pool, providing an electrical connection between the bonding conductor and the conductive system. The bonding conductor providing equipotential bonding for the component attached to the aboveground pool.
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