DEPOSITION METHOD FOR TUNGSTEN-CONTAINING FILM USING TUNGSTEN COMPOUND, AND PRECURSOR COMPOSITION FOR DEPOSITING TUNGSTEN-CONTAINING FILM, COMPRISING TUNGSTEN COMPOUND

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United States of America Patent

APP PUB NO 20160122867A1
SERIAL NO

14893427

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Abstract

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The present disclosure relates to a deposition method for a tungsten-containing film using a tungsten compound and a precursor composition for depositing the tungsten-containing film including the tungsten compound.

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Patent Owner(s)

Patent OwnerAddress
UP CHEMICAL CO LTD81 SANDAN-RO 197BEON-GIL PYEONGTAEK-SI GYEONGGI-DO PYEONGTAEK-SI 17749

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAN, Won Seok Anseong-si, KR 44 157
LEE, Hong-Joo Deojeon, KR 1 4
YOO, Beom-Sang Asan-si, KR 1 4

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