COMPOSITIONS AND METHODS FOR REMOVING CERIA PARTICLES FROM A SURFACE
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United States of America Patent
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Issued Date -
May 5, 2016
app pub date -
May 14, 2014
filing date -
May 17, 2013
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Abstract
A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The removal compositions include at least one surfactant. The composition achieves highly efficacious removal of the ceria particles and CMP contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.
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