IMPRINTED MULTI-LAYER STRUCTURE

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United States of America Patent

APP PUB NO 20160122559A1
SERIAL NO

14526595

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An imprinted multi-layer structure includes a support and a structured bi-layer on or over the support, The structured bi-layer includes a first cured layer having a first cross-linked material on or over the support. A second cured layer has a second material different from the first material on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least a depth greater than the thickness of the second cured layer. The first material is cross-linked to the second material.

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BANK OF AMERICA N A AS AGENTFOUR PENN CENTER SUITE 1200 1600 JFK BOULEVARD PHILADELPHIA PA 19103

International Classification(s)

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  • 2014 Application Filing Year
  • C09D Class
  • 2516 Applications Filed
  • 1980 Patents Issued To-Date
  • 78.70 % Issued To-Date
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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cok, Ronald Steven Rochester, US 217 2243
Lebens, John Andrew Rush, US 38 406
Wang, Yongcai Rochester, US 198 1529

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  • C09D Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges98324511032101 - 1011 - 2021 - 3031 - 4041 - 5061 - 70020406080100120140160180200220240260280300320340360

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