HYDROPHOBIC INORGANIC PARTICLES, RESIN COMPOSITION FOR HEAT DISSIPATION MEMBER, ELECTRONIC COMPONENT DEVICE AND HYDROPHOBIC INORGANIC PARTICLE MANUFACTURING METHOD
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United States of America Patent
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May 5, 2016
app pub date -
Mar 31, 2014
filing date -
May 30, 2013
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Disclosed are hydrophobic inorganic particles obtained by surface-modifying inorganic particles with an organic compound, in which, when 200 parts by mass of ethanol is added to 1 part by mass of the hydrophobic inorganic particles, ultrasonic washing is performed for 10 minutes, solid-liquid separation is performed, and 0.1 g of the dried hydrophobic inorganic particles are dispersed in 40 g of a liquid mixture obtained by mixing hexane and water in a volume ratio of 1:1, 50% by mass or greater of the hydrophobic inorganic particles are transformed to a phase in which hexane is included.
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