COMPOSITION FOR METAL BONDING
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 5, 2016
app pub date -
May 14, 2014
filing date -
May 16, 2013
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
Provided is a composition for metal bonding, especially a bonding composition containing metal particles, which is capable of achieving high bonding strength by bonding at a relatively low temperature without the application of a pressure, and which has heat resistance and is thus not susceptible to decrease in the bonding strength due to decomposition or deterioration of a resin component when the service temperature thereof is increased. A bonding composition which is characterized by containing two or more kinds of metal particles having different average particle diameters, an organic component and a dispersant, and which is also characterized in that the particle diameter ratio of the average particle diameter (DS) of metal particles (S) that have the smallest average particle diameter to the average particle diameter (DL) of metal particles (L) that have the largest average particle diameter, namely DS/DL is from 1×10-4 to 0.5.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully