HYBRID BARRIER LAYER FOR SUBSTRATES AND ELECTRONIC DEVICES
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United States of America Patent
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Issued Date -
Apr 28, 2016
app pub date -
Jun 21, 2014
filing date -
Jun 21, 2013
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Abstract
Systems and techniques for depositing multiple different organic precursors, with reactive gases, such as by plasma polymerization, are provided. Using multiple precursor materials may provide for a much larger process regime, thus enabling for precise tuning of barrier properties and stress of the films. A barrier film as disclosed herein may be used on variety of substrates and electronic devices to reduce the permeation of moisture and other atmospheric contaminants.
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