CIRCUIT STRUCTURE OF A FLIP-CHIP LIGHT EMITTING DIODE
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United States of America Patent
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Issued Date -
Apr 28, 2016
app pub date -
Jun 8, 2015
filing date -
Oct 28, 2014
priority date (Note) -
Abandoned
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Abstract
The invention relates to a circuit structure of a flip-chip light emitting diode. It is provided for assembling of the flip-chip light emitting diode. Each flip-chip light emitting diode has at least two electrodes. The circuit structure defines a light emitting surface on a surface of a substrate, and the light emitting surface is provided with a plurality of reflective and conductive surfaces. The reflective and conductive surface is used for assembling of the electrodes of the flip-chip light emitting diode. At least one flip-chip light emitting diode is connected in series, parallel or series-parallel on the light emitting surface, wherein the total area of the reflective and conductive surface accounts for 80% to 99% of the area of the light emitting surface. Accordingly, the circuit structure of the flip-chip light emitting diode can efficiently improve the luminous efficiency of flip-chip light emitting diode device by adding a proportion of the area of the reflective conduction surfaces on the substrate of the flip-chip light emitting diode.
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