Minimal Contact Wet Processing Systems and Methods
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United States of America Patent
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Issued Date -
Apr 28, 2016
app pub date -
Oct 28, 2014
filing date -
Oct 28, 2014
priority date (Note) -
Abandoned
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Abstract
Embodiments provided herein describe systems and methods for processing substrates. A substrate having a first region and a second region is provided. A container is positioned proximate to the first region of the substrate. The container has an opening on an end thereof adjacent to the substrate. A processing liquid is dispensed into the container such that the processing liquid contacts the first region of the substrate through the opening. The gaseous pressure in a portion of the container devoid of the processing liquid is reduced. The reduction of the gaseous pressure prevents the processing liquid from flowing from the first region of the substrate to the second region of the substrate.
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