Bond head cooling apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10622329
APP PUB NO 20160116217A1
SERIAL NO

14524225

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ASMPT SINGAPORE PTE LTD2 YISHUN AVENUE 7 SINGAPORE 768924

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Law, Yi Kei Kwai Chung, HK 2 2
Leung, Pak Kin Kwai Chung, HK 6 9
Tang, Chuek Wah Kwai Chung, HK 2 2
Widdowson, Gary Peter Kwai Chung, HK 35 214

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Oct 14, 2027
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 14, 2031
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00