HEAT DISSIPATING PLATE DEVICE FOR LIGHT EMITTING DIODE, HEAD LAMP FOR AUTOMOBILE AND METHOD FOR PREPARING THE SAME

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United States of America Patent

SERIAL NO

14520917

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Abstract

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A heat dissipating plate for a light emitting diode (LED) includes a metal thin film containing a hydroxyl functional group (—OH). A coating layer is disposed on at least one surface of the metal thin film and includes a carbon nanotube containing a hydrophilic functional group. The coating layer is attached to the metal thin film by bonding the hydroxyl functional group with the hydrophilic functional group in a hydrogen bond.

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Patent Owner(s)

Patent OwnerAddress
HYUNDAI MOTOR COMPANY12 HEOLLEUNG-RO SEOCHO-GU SEOUL 06797
THE BOARD OF REGENTS OF THE NEVADA SYSTEM OF HIGHER EDUCATION ON BEHALF OF THE UNIVERSITY OF NEVADA LAS VEGAS4505 SOUTH MARYLAND PARKWAY LAS VEGAS NV 89154

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, Bong Jun Chestnut Hill, US 14 15
CHO, Byoung Kyu Seoul, KR 1 0
KIM, Kwang Jin Henderson, US 21 32
KIM, Yool Koo Ansan-si, KR 6 11

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