Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element

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United States of America Patent

PATENT NO 10208206
APP PUB NO 20160115318A1
SERIAL NO

14889545

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Abstract

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The present invention relates to a curable resin composition comprising (A) an epoxy compound having three or more epoxy groups in one molecule and (B) an active hydrogen compound.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI CHEMICALS CORPORATIONTOKYO 101-8101

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kaji, Satoru Tokyo, JP 4 100
Kodama, Tamotsu Tokyo, JP 14 56
Watanabe, Ryoko Tokyo, JP 5 55

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