UNIFORM POLISHING WITH FIXED ABRASIVE PAD
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United States of America Patent
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Issued Date -
Apr 28, 2016
app pub date -
Oct 24, 2014
filing date -
Oct 24, 2014
priority date (Note) -
Abandoned
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Abstract
A polishing pad for use in chemical mechanical polishing of a substrate is disclosed. The polishing pad includes first and second major surfaces. The first major surface forms a polishing surface and is divided into a main portion and edge portions. The edge portions are nearer to edges of the polishing pad while the main portion is between the edge portions and farther from the edges of the polishing pad. The polishing pad also includes a plurality of polishing posts disposed on the first major surface of the pad. The densities of the polishing posts in the edge portions and main portion are different.
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