PACKAGE-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURES FOR A SUBSTRATE
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United States of America Patent
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Issued Date -
Apr 21, 2016
app pub date -
Oct 21, 2015
filing date -
Oct 21, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A electromagnetic interference shielding device is disclosed having a first substrate one or more surfaces. One or more laminates are operatively attached to the one or more surfaces of the first substrate. A cavity is provided that is defined by the first substrate and its corresponding one or more laminates and at least one inner lateral portion. The cavity is operable to receive one or more microelectromechanical system (MEMS) components. A first conductive structure integrally formed with a trench or via array of the substrate spans a thickness defined by one or more of surfaces of the first substrate, the first conductive structure operable to shield electromagnetic interference between MEMS components assembled with the first substrate.
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