Low-cost solar cell metallization over TCO and methods of their fabrication
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United States of America Patent
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Feb 21, 2017
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app pub date -
May 12, 2015
filing date -
Nov 18, 2011
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Abstract
Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.
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