NEW STRUCTURE OF MICROELECTRONIC PACKAGES WITH EDGE PROTECTION BY COATING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160111380A1
SERIAL NO

14919696

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed herein are edge-coated microelectronic packages comprising a microelectronic package having a top, a bottom, and an exposed edge, and a coating comprising a polymer, wherein the microelectronic package comprises a glass substrate, and wherein the coating covers at least a portion of the top, at least a portion of the bottom, and at least a portion of the exposed edge of the microelectronic package. Also disclosed herein are methods of making and using edge-coated microelectronic packages.

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Patent Owner(s)

Patent OwnerAddress
GEORGIA TECH RESEARCH CORPORATION505 TENTH STREET N W ATLANTA GA 30332-0415

International Classification(s)

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  • 2015 Application Filing Year
  • H01L Class
  • 25498 Applications Filed
  • 22451 Patents Issued To-Date
  • 88.06 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SMET, Vanessa Atlanta, US 3 40
SUNDARAM, Venkatesh Alpharetta, US 27 785
TUMMALA, Rao R Greensboro, US 29 819

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Patent Citation Ranking

  • 27 Citation Count
  • H01L Class
  • 88.36 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1792827316886303131891006776342711301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000

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