COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL

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United States of America Patent

APP PUB NO 20160111179A1
SERIAL NO

14777669

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A copper alloy for electric and electronic devices includes: Zn from more than 2 mass % to less than 23 mass %; Sn at 0.1 mass % or more and 0.9 mass % or less; Ni at 0.05 mass % or more and less than 1.0 mass %; Fe at 0.001 mass % or more and less than 0.10 mass %; P at 0.005 mass % or more and 0.1 mass % or less; and a balance including Cu and unavoidable impurities, wherein a ratio Fe/Ni satisfies 0.002≦Fe/Ni<1.5 by atomic ratio, a ratio (Ni+Fe)/P satisfies 3<(Ni+Fe)/P<15 by atomic ratio, a ratio Sn/(Ni+Fe) satisfies 0.33; Σ9; Σ27a; and Σ27b special grain boundaries.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATION2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 100-8117
MITSUBISHI SHINDOH CO LTDTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MAKI, Kazunari Saitama-shi, JP 74 205
MORI, Hiroyuki Tsukuba-shi, JP 401 3349
YAMASHITA, Daiki Osaka, JP 35 428

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