METHOD OF APPLYING METALLIC LAYER ON SUBSTRATE AND COMPOSITE ARTICLE FORMED THEREBY
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United States of America Patent
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Issued Date -
Apr 21, 2016
app pub date -
Oct 16, 2015
filing date -
Oct 17, 2014
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Abstract
A method of preparing a composite article is disclosed. The method comprises the step of providing a substrate having a melting point temperature T1. The method additionally comprises the step of forming a buffer layer having a melting point temperature T2 on the substrate. Finally, the method comprises the step of forming a metallic layer having a melting point temperature T3 on the buffer layer to prepare the composite article. In the method to prepare the composite article, T1
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