CYANATE RESIN COMPOSITION AND USE THEREOF
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United States of America Patent
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Apr 21, 2016
app pub date -
May 30, 2013
filing date -
May 30, 2013
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Abstract
The present invention relates to a cyanate resin composition, and a prepreg, a laminate, a metal foil clad laminate and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A), an epoxy resin (B) with a structure of formula (I) and a maleimide compound (C). The cyanate resin composition of the present invention, and the prepreg, the laminate and the metal foil clad laminate prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame retardancy and reliability, and are suitable for being used as a substrate material for manufacturing a high-density printed circuit board.
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