CMP POLISHING SOLUTION AND POLISHING METHOD USING SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160107286A1
SERIAL NO

14786928

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A CMP polishing liquid for polishing a ruthenium-based metal, comprising polishing particles, an acid component, an oxidizing agent, a triazole-based compound, a quaternary phosphonium salt and water, wherein the acid component contains at least one selected from the group consisting of inorganic acids, monocarboxylic acids, carboxylic acids having a plurality of carboxyl groups and having no hydroxyl group, and salts thereof, the polishing particles have a negative zeta potential in the CMP polishing liquid, and the pH of the CMP polishing liquid is 3.0 or more and less than 7.0.

First Claim

See full text

Other Claims data not available

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
HITACHI CHEMICAL COMPANY LTD9-2 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 100-6606

International Classification(s)

loading....
  • 2014 Application Filing Year
  • B24B Class
  • 633 Applications Filed
  • 543 Patents Issued To-Date
  • 85.79 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HANANO, Masayuki Chiyoda-ku, Tokyo, JP 14 97
MISHIMA, Kouji Chiyoda-ku, Tokyo, JP 8 59
SAKASHITA, Masahiro Chiyoda-ku, Tokyo, JP 13 248

Cited Art Landscape

Load Citation

Patent Citation Ranking

  • 6 Citation Count
  • B24B Class
  • 20.18 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges17558466211351201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 70050100150200250300350400450500550600650

Forward Cite Landscape

Load Citation