SOLDER ALLOY
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United States of America Patent
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Issued Date -
Apr 21, 2016
app pub date -
Dec 22, 2015
filing date -
Dec 1, 2004
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Abstract
An alloy suitable for use in a wave solder process, hot air levelling process, a ball grid array or chip scale package comprising no more than 3 wt.% bismuth, from 0.15-1.5 wt.% copper, from 0.1-1.5 wt.% silver, and the balance tin, with optionally other alloying elements in certain embodiments, together with unavoidable impurities.
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