LOW PROFILE HEAT SINK

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160106000A1
SERIAL NO

14881338

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat sink for an electronic component includes a base having a width. The base has a greater thickness at a middle portion along the width than at opposite end portions along the width. A plurality of elongate fins project from an upper surface of the base and extend in directions perpendicular to the upper surface.

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Patent Owner(s)

Patent OwnerAddress
PANASONIC AUTOMOTIVE SYSTEMS COMPANY OF AMERICA DIVISION OF PANASONIC CORPORATION OF NORTH AMERICA776 HWY 74 SOUTH PEACHTREE CITY GA 30269

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
TANG-KONG, GERALD ANTHONY NEWNAN, US 4 15

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Patent Citation Ranking

  • 6 Citation Count
  • H05K Class
  • 12.91 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges273132632898442084531501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +010020030040050060070080090010001100120013001400

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