THERMAL INTERPOSER SUITABLE FOR ELECTRONIC MODULES
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United States of America Patent
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Issued Date -
Apr 14, 2016
app pub date -
Jun 25, 2014
filing date -
Jun 26, 2013
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Abstract
A thermal interposer for use in providing a mating interface between a heat sink and an electronic module includes an elongated body portion having two opposing surfaces. On one surface, a plurality of press-fit pegs are defined that extend upwardly and outwardly away from the interposer body portion. On the other, opposing surface, a plurality of contact arms are defined that extend, in cantilevered fashion, downwardly and away from the interposer body portion. The press-fit pins are configured to enter grooves formed in a heat sink in a manner to form intimate, metal to metal, contact while the contact arms are configured to contact the top surface of an electronic module with reliable normal force.
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