OPTICAL SEMICONDUCTOR DEVICE INCLUDING BLACKENED TARNISHABLE BOND WIRES AND RELATED METHODS
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United States of America Patent
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Issued Date -
Apr 14, 2016
app pub date -
Oct 13, 2014
filing date -
Oct 13, 2014
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Abstract
A method for making an optical semiconductor device may include forming an integrated circuit (IC) including an optical sensing area and a bond pads outside the optical sensing area, and coupling proximal ends of respective bond wires to corresponding bond pads. The method may further include performing a blackening treatment on the bond wires.
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