Systems and methods for horizontal integration of acceleration sensor structures
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United States of America Patent
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May 3, 2016
Grant Date -
Apr 14, 2016
app pub date -
Oct 13, 2014
filing date -
Oct 13, 2014
priority date (Note) -
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Abstract
Embodiments relate to integrated circuit sensors, and more particularly to sensors integrated in an integrated circuit structure and methods for producing the sensors. In an embodiment, a sensor device comprises a substrate; a first trench in the substrate; a first moveable element suspended in the first trench by a first plurality of support elements spaced apart from one another and arranged at a perimeter of the first moveable element; and a first layer arranged on the substrate to seal the first trench, thereby providing a first cavity containing the first moveable element and the first plurality of support elements.
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