Semiconductor Device and a Method of Manufacturing Same
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United States of America Patent
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Oct 8, 2015
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Oct 14, 2014
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Abstract
With an SiC semiconductor device, the surface of a termination region is covered with a passivation film, and the passivation film is provided with a thermal silicon oxide film which is in contact with the surface of the termination region, a CVD silicon oxide film deposited on the thermal silicon oxide film so as to be in contact with the thermal silicon oxide film, and a CVD silicon oxide film deposed on the CVD silicon oxide film so as to be in contact with the CVD silicon oxide film. By so doing, an electric field applied on the passivation film is relaxed, while production cost is reduced.
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