ELECTROLYTES FOR HIGH TEMPERATURE EDLC
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United States of America Patent
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Issued Date -
Apr 7, 2016
app pub date -
Oct 7, 2014
filing date -
Oct 7, 2014
priority date (Note) -
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Abstract
An electrolyte composition, including:
- an electrolyte comprising a conductive salt; anda mixture comprising an alkyl nitrile and an alkyl dinitrile, wherein the electrolyte composition has a depressed vapor pressure at 85° C., as defined herein. Also disclosed is an article incorporating the electrolyte composition and methods for making and using the article at elevated temperatures.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
CORNING INCORPORATED | SP-TI-03-1 CORNING NY 14831 |
International Classification(s)

- 2014 Application Filing Year
- H01G Class
- 961 Applications Filed
- 811 Patents Issued To-Date
- 84.40 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Jayaraman, Shrisudersan | Painted Post, US | 25 | 138 |
# of filed Patents : 25 Total Citations : 138 | |||
Kadam, Rahul Suryakant | Corning, US | 18 | 57 |
# of filed Patents : 18 Total Citations : 57 | |||
Massey, Steven Isaac | Big Flats, US | 2 | 1 |
# of filed Patents : 2 Total Citations : 1 | |||
Polasani, Shivani Rao | Corning, US | 12 | 6 |
# of filed Patents : 12 Total Citations : 6 |
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Patent Citation Ranking
- 1 Citation Count
- H01G Class
- 13.25 % this patent is cited more than
- 9 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 7, 2027 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent Application No: 2021/0047,138
MAILER DISPENSERS
Abstract
A dispenser (200) includes a supply structure (202) and a biasing structure (206). The supply structure holds mailers (204). A mailer from the mailers includes a first wall and a second wall. The first and second walls are closed at a first side of the mailer, closed at a second side of the mailer, and closed at a closed end of the mailer. The first and second walls are not closed at an open end of the mailer. The mailer is arranged to be dispensed from the supply structure (202). The biasing structure (206) is arranged to engage the mailer as the mailer is dispensed from the supply structure (202). The biasing structure (206) has narrowing surfaces configured to contact the sides of the mailer as the mailer is dispensed. The narrowing surfaces of the biasing structure (206) are arranged to narrow the open end of the mailer thereby causing the open end to be biased open.
Description
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